Increasing device complexity and the continuing drive for higher levels of quality are fostering a reconsideration of test strategies. To be effective, test engineers must choose how to optimally ...

IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors, which will ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.