As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...

Researchers have combined liquid metal and a heat-activated adhesive to create an electrically conductive patch that bonds to fabric when heated with a hot iron.

IIIF provides researchers rich metadata and media viewing options for comparison of works across cultural heritage collections. Visit the IIIF page to learn more. Integrated circuits consist of ...

While previous p-bit proposals included an analog component and DAC, the new research offers an all-digital p-bit design. “The reliance on analog signals was holding back progress,” said Shunsuke ...

Intel recently confirmed the latest results in its partnership with ASML. The US chipmaker worked with engineers from the European corporation to install, test, and validate ...

In one test, the researchers' nanofabrication method yielded quantum coherence of up to 24 milliseconds, which would ...

MIT researchers developed a new fabrication method that could enable them to stack multiple active components, like transistors and memory units, on top of an existing circuit, which would improve the ...

Why the drone industry depends on aviation-grade semiconductors for autonomy, safety, certification, and long-term operational resilience.

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Brain activity during speech follows a layered timing pattern that matches large language model steps, showing how meaning builds gradually.