A new technical paper titled “Hardware-software co-exploration with racetrack memory based in-memory computing for CNN ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

Reflections from a recent panel discussion at DAC, The Chips to Systems Conference held at Moscone West on the CHIPS Act's impact on the design ecosystem ...

Defects can show up in the clock trees that drive scan chains, and even inside blocks of scan cells, which may number in the ...

Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. “We propose FastPath, a hybrid verification methodology ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...