A new technical paper titled “Hardware-software co-exploration with racetrack memory based in-memory computing for CNN ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

Defects can show up in the clock trees that drive scan chains, and even inside blocks of scan cells, which may number in the ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. “We propose FastPath, a hybrid verification methodology ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.